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| EGL1A ... EGL1M EGL1A ... EGL1M Superfast Switching Surface Mount Si-Rectifiers Superschnelle Si-Gleichrichter fur die Oberflachenmontage Version 2007-04-05 Nominal current - Nennstrom Repetitive peak reverse voltage Periodische Spitzensperrspannung Plastic case MiniMELF Kunststoffgehause MiniMELF Weight approx. - Gewicht ca. Plastic material has UL classification 94V-0 Gehausematerial UL94V-0 klassifiziert Standard packaging taped and reeled Standard Lieferform gegurtet auf Rolle 1.6 1A 50...1000 V DO-213AA 0.04 g 3.5 Dimensions - Mae [mm] Marking: Kennzeichnung: Maximum ratings Type Typ EGL1A EGL1B EGL1D EGL1G EGL1J EGL1K EGL1M Repetitive peak reverse voltage Periodische Spitzensperrspannung VRRM [V] 50 100 200 400 600 800 1000 EGL1A...EGL1G EGL1J...EGL1M Surge peak reverse voltage Stospitzensperrspannung VRSM [V] 50 100 200 400 600 800 1000 TA = 75C TA = 50C f > 15 Hz TA = 25C TA = 25C IFAV IFAV IFRM IFSM i2t Tj TS 0.4 0.4 1. green ring denotes "cathode" and "superfast switching rectifier family" 2. colored ring denotes "repetitive peak reverse voltage" (see below) 1. gruner Ring kennzeichnet "Kathode" und "superschnelle Gleichrichter" 2. farbiger Ring kennzeichnet "Periodische Spitzensperrspannung" (siehe unten) Grenzwerte 2. Cathode ring 2. Kathodenring gray / grau red / rot orange / orange yellow / gelb green / grun blue / blau violett / violet 1 A 1) 1 A 1) 8 A 1) 25/30 A 4.5 A2s -50...+175C -50...+175C Max. average forward rectified current Dauergrenzstrom in Einwegschaltung Repetitive peak forward current Periodischer Spitzenstrom Peak forward surge current, 50/60 Hz half sine-wave Stostrom fur eine 50/60 Hz Sinus-Halbwelle Rating for fusing, t < 10 ms Grenzlastintegral, t < 10 ms Junction temperature - Sperrschichttemperatur Storage temperature - Lagerungstemperatur 1 Mounted on P.C. board with 25 mm2 copper pads at each terminal Montage auf Leiterplatte mit 25 mm2 Kupferbelag (Lotpad) an jedem Anschluss http://www.diotec.com/ (c) Diotec Semiconductor AG 1 EGL1A ... EGL1M Characteristics Type Typ Tj = 25C EGL1A ... EGL1D EGL1G EGL1J ... EGL1M Leakage current Sperrstrom Thermal resistance junction to ambient air Warmewiderstand Sperrschicht - umgebende Luft Thermal resistance junction to terminal Warmewiderstand Sperrschicht - Anschluss Reverse recovery time Sperrverzugszeit trr [ns] 1) < 50 < 50 < 75 Tj = 25C Tj = 125C Kennwerte Forward voltage Durchlass-Spannung VF [V] < 1.25 < 1.35 < 1.8 VR = VRRM VR = VRRM IR IR RthA RthT at / bei IF [A] 1 1 1 < 5 A < 50 A < 75 K/W 2) < 40 K/W 120 [%] 100 EGL1A...EGL1G 10 [A] EGL1A...D 1 80 EGL1J...EGL1M EGL1G EGL1J...M 60 10 -1 40 10-2 20 IFAV 0 0 TA 50 100 150 [C] 1 IF 10 -3 Tj = 25C 0.4 VF 0.8 1.0 1.2 1.4 [V] 1.8 Rated forward current versus ambient temperature ) 1 Zul. Richtstrom in Abh. von der Umgebungstemp. ) Forward characteristics (typical values) Durchlasskennlinien (typische Werte) 1 2 IF = 0.5 A through/uber IR = 1 A to/auf IR = 0.25 A Mounted on P.C. board with 25 mm2 copper pads at each terminal Montage auf Leiterplatte mit 25 mm2 Kupferbelag (Lotpad) an jedem Anschluss http://www.diotec.com/ (c) Diotec Semiconductor AG 2 |
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